1
von Maycock, Jonathan (Autor),
Erschienen in Proceedings of the 1st IEEE International Conference on Applied Bionics and Biomechanics (ICABB-2010), Venice, Italy, October 2010, Piscataway (N.J.): 2010, 8 S., Lit.
Verfügbarkeit
Erschienen in Proceedings of the 1st IEEE International Conference on Applied Bionics and Biomechanics (ICABB-2010), Venice, Italy, October 2010, Piscataway (N.J.): 2010, 8 S., Lit.
2
von Hwang, Tonghun (Autor),
Erschienen in 2022 IEEE International Conference on Consumer Electronics (ICCE) : 2022 IEEE International Conference on Consumer Electronics (ICCE) took place January 7-9, 2022 virtually, Piscataway (N.J.): 2022, [5 S.], Lit.
Verfügbarkeit
Erschienen in 2022 IEEE International Conference on Consumer Electronics (ICCE) : 2022 IEEE International Conference on Consumer Electronics (ICCE) took place January 7-9, 2022 virtually, Piscataway (N.J.): 2022, [5 S.], Lit.
3
von Česonis, Justinas (Autor),
Erschienen in Learning from the past, looking to the future : 2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society ; July 17-21, 2018, Hawaii Convention Center, Honolulu, Hawaii, Piscataway (N.J.): 2018, S. 5166-5169, Lit.
Verfügbarkeit
Erschienen in Learning from the past, looking to the future : 2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society ; July 17-21, 2018, Hawaii Convention Center, Honolulu, Hawaii, Piscataway (N.J.): 2018, S. 5166-5169, Lit.
4
von Franklin, Sae (Autor),
Erschienen in Learning from the past, looking to the future : 2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society ; July 17-21, 2018, Hawaii Convention Center, Honolulu, Hawaii, Piscataway (N.J.): 2018, S. 5170-5173, Lit.
Verfügbarkeit
Erschienen in Learning from the past, looking to the future : 2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society ; July 17-21, 2018, Hawaii Convention Center, Honolulu, Hawaii, Piscataway (N.J.): 2018, S. 5170-5173, Lit.